Ensinger-TECAFORM-AH-ESD-PEEK (Dry-as-molded)
Ensinger-TECAFORM-AH-ESD-PEEK (Dry-as-molded) material properties: Density 1.34 g/cm3, Young's modulus 4.12 GPa, Yield strength 73.9 MPa (representative...
Overview
polymer · conductive and ESD polymer — Dry-as-molded representative condition
Grade designation: Ensinger-TECAFORM-AH-ESD-PEEK-DRY
Ensinger-TECAFORM-AH-ESD-PEEK; manufacturer/trade: Ensinger; curated real material/grade family record
Curated real material/grade record. Ensinger trade or supplier catalog grade retained from grade name. Property values are representative literature ranges; consult linked references, standards, and manufacturer datasheets for design allowables.
Key material properties
| Density | 1.34 g/cm3 |
|---|---|
| Young's modulus | 4.12 GPa |
| Yield strength | 73.9 MPa (representative value; grade and condition dependent) |
| Thermal conductivity | 0.583 W/mK |
| Heat resistance / melting point | 165.6 C |
Published property ranges
| Density (g/cm3) | CAMPUS Plastics: 1.283–1.378; MatWeb: 1.245–1.407; Polymer handbook: 1.272–1.366 |
|---|---|
| Young's modulus (GPa) | CAMPUS Plastics: 3.955–4.197; MatWeb: 3.679–4.41; Polymer handbook: 3.875–4.11 |
| Thermal conductivity (W/mK) | CAMPUS Plastics: 0.565–0.584; MatWeb: 0.476–0.652; Polymer handbook: 0.539–0.556 |
Ranges are representative values from the cited handbooks/datasheets; use manufacturer datasheets for design allowables.
Typical uses
- ESD tray
- semiconductor transport
- conductive housing
- sensor component
Frequently asked questions
What is the density of Ensinger-TECAFORM-AH-ESD-PEEK (Dry-as-molded)?
The density of Ensinger-TECAFORM-AH-ESD-PEEK (Dry-as-molded) is 1.34 g/cm3.
What is Ensinger-TECAFORM-AH-ESD-PEEK (Dry-as-molded) used for?
Ensinger-TECAFORM-AH-ESD-PEEK (Dry-as-molded) is typically used for ESD tray, semiconductor transport, conductive housing and sensor component.
What condition does Ensinger-TECAFORM-AH-ESD-PEEK-DRY refer to?
Ensinger-TECAFORM-AH-ESD-PEEK-DRY refers to the "Dry-as-molded" condition: Dry-as-molded representative condition.
What category of material is Ensinger-TECAFORM-AH-ESD-PEEK (Dry-as-molded)?
Ensinger-TECAFORM-AH-ESD-PEEK (Dry-as-molded) is categorized as polymer (family: conductive and ESD polymer).
Internal tools
Related materials
- Chemours-Teflon-ETFE-200 (Conditioned)
- Chemours-Teflon-ETFE-200 (Dry-as-molded)
- Chemours-Teflon-ETFE-EP-541 (Conditioned)
- Chemours-Teflon-ETFE-EP-541 (Dry-as-molded)
- Chemours-Teflon-ETFE-LM-740AP (Conditioned)
- Chemours-Teflon-ETFE-LM-740AP (Dry-as-molded)
- Ensinger-TECAFORM-AH-CF-PEEK (Conditioned)
- Ensinger-TECAFORM-AH-CF-PEEK (Dry-as-molded)
References
- Polymer Data Handbook / CAMPUS-style datasheet references (Polymer handbook)
- Polyetheretherketone — PubChem compound entry (PubChem (NCBI))
- Polyoxymethylene — Wikipedia (Wikipedia)
- Polymer Data Handbook / CAMPUS-style datasheet references