Ensinger-TECAFORM-AH-CF-PEEK (Dry-as-molded)

Ensinger-TECAFORM-AH-CF-PEEK (Dry-as-molded) material properties: Density 1.318 g/cm3, Young's modulus 3.99 GPa, Yield strength 69.6 MPa (representative...

Overview

polymer · conductive and ESD polymer — Dry-as-molded representative condition

Grade designation: Ensinger-TECAFORM-AH-CF-PEEK-DRY

Ensinger-TECAFORM-AH-CF-PEEK; manufacturer/trade: Ensinger; curated real material/grade family record

Curated real material/grade record. Ensinger trade or supplier catalog grade retained from grade name. Property values are representative literature ranges; consult linked references, standards, and manufacturer datasheets for design allowables.

Key material properties

Density1.318 g/cm3
Young's modulus3.99 GPa
Yield strength69.6 MPa (representative value; grade and condition dependent)
Thermal conductivity0.547 W/mK
Heat resistance / melting point159.4 C

Published property ranges

Density (g/cm3)CAMPUS Plastics: 1.266–1.359; MatWeb: 1.293–1.388; Polymer handbook: 1.255–1.347
Young's modulus (GPa)CAMPUS Plastics: 3.828–4.06; MatWeb: 4.024–4.272; Polymer handbook: 3.748–3.973
Thermal conductivity (W/mK)CAMPUS Plastics: 0.524–0.54; MatWeb: 0.587–0.608; Polymer handbook: 0.498–0.512

Ranges are representative values from the cited handbooks/datasheets; use manufacturer datasheets for design allowables.

Typical uses

Frequently asked questions

What is the density of Ensinger-TECAFORM-AH-CF-PEEK (Dry-as-molded)?

The density of Ensinger-TECAFORM-AH-CF-PEEK (Dry-as-molded) is 1.318 g/cm3.

What is Ensinger-TECAFORM-AH-CF-PEEK (Dry-as-molded) used for?

Ensinger-TECAFORM-AH-CF-PEEK (Dry-as-molded) is typically used for ESD tray, semiconductor transport, conductive housing and sensor component.

What condition does Ensinger-TECAFORM-AH-CF-PEEK-DRY refer to?

Ensinger-TECAFORM-AH-CF-PEEK-DRY refers to the "Dry-as-molded" condition: Dry-as-molded representative condition.

What category of material is Ensinger-TECAFORM-AH-CF-PEEK (Dry-as-molded)?

Ensinger-TECAFORM-AH-CF-PEEK (Dry-as-molded) is categorized as polymer (family: conductive and ESD polymer).

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References

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